| 摘要 |
<P>PROBLEM TO BE SOLVED: To exclude liquid air source through filling a gap among expanded materials in a liquid air thermal insulation system. <P>SOLUTION: A putty-like gap-filling compound 40 is provided, comprising a base material, microspheres and a catalyst. This compound 40 is usable at temperatures ranging from about -250°C to about 260°C. This compound 40 is obtained by mixing the base material and the microspheres together followed by adding the catalyst to the mixture just before filling. After adding the catalyst, the resultant mixture becomes semi-solid, and in this condition, is filled in a gap surrounding unfixed thermal insulation materials 10, fixed thermal insulation materials 20 and a housing 30. Thereafter, the compound 40 is hardened, becoming a semi-rigid cryogenic thermal insulation material. Thus, during operating the SSME(space shuttle main engine), the flow of the resultant compound 40 and the movement of the expanded materials are prevented, enabling liquid air to be prevented from being formed and frozen in the liquid air thermal insulation system. This compound 40 is easy to produce and apply, and the gap in the system can be easily confirmed and the compound 40 can be easily filled. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
