SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING SAME

摘要

Disclosed are a semiconductor device mounted on a supporting substrate and a process for manufacturing the same. Specifically disclosed is a semiconductor device wherein a selected electrode pad for external connection of the semiconductor device is led to the other major surface of the supporting substrate through an opening or cut provided in the substrate and electrically connected with a wiring layer arranged on the other major surface of the supporting substrate. The semiconductor device can be reduced in size furthermore by employing such a structure and its manufacturing process is also disclosed.