| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a short circuit and disconnection due to large deformation of bonding wires for connecting electrodes of semiconductor chips and the conductor pattern of a printed wiring board in a semiconductor device manufacturing method, wherein the semiconductor chips are mounted face up on the printed wiring board formed with a protective insulation film by using a film-like resist, and then the plurality of semiconductor chips are collectively sealed by transfer molding. <P>SOLUTION: At the time of transfer molding, as many through holes as possible are formed which lead to the external space of a lower mold, near the end of a printed wiring board and of the suction surface of the lower mold which sucks the printed wiring board that is on the opposite side of the gate of a cavity for pouring a molding resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
