发明名称 METHOD AND DEVICE FOR PEELING FILM
摘要 PROBLEM TO BE SOLVED: To make a substrate free of damage in initial peeling and to prevent generation of dust of a resist film when the initial peeling is carried out to peel a cover film of the resist film (photosensitive film) stuck on the substrate and the cover film is thoroughly removed from a initially peeled portion. SOLUTION: In the initial peeling, between the substrate 2 and the photosensitive film (resist film) 2a, a peeling edge 21 is laid and moved under slight pressure along a surface of the substrate 2 so that the edge 21 passes one side and an adjacent side constituting a corner of the photosensitive film 2a, whereby the photosensitive film 2a is peeled from the substrate 2 at the corner, and by this peeling, the cover film 2b is peeled from the photosensitive film 2a. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006064790(A) 申请公布日期 2006.03.09
申请号 JP20040244553 申请日期 2004.08.25
申请人 HITACHI INDUSTRIES CO LTD;SANKI PRECISION:KK 发明人 KAWAMURA RYOSUKE;AYABE TOSHIAKI;YAMAMOTO SATOSHI
分类号 G03C11/12 主分类号 G03C11/12
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