发明名称 METHOD OF MOLDING RESIN MOLDING AND MOLDING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To fill the space between two resin layers with an adhesive while preventing a skin material part at a position below an adhesive injecting nozzle from being damaged, and prevent dents from generating on the surface side of the skin material part, when obtaining a resin laminate by bonding two resin layers by injecting an adhesive between the resin layers. <P>SOLUTION: The method and the apparatus for molding resin moldings are characterised in that a skin material layer 2 is set to a lower mold 11 and a base material layer 3 equipped with a boss part 8 having a nozzle inserting hole 8h is set to an upper mold 12, a large diameter part 9 having a diameter larger than by a specified dimension the diameter of a guide part 8g for the injection nozzle 21 a specified dimension is preliminarily formed in the opening part on the insertion side of the nozzle inserting hole 8h, and the adhesive is injected into the nozzle inserting hole 8h from the tip end face of the injection nozzle 21 while retracting the injection nozzle 21 until the opening part on the insertion side of the inserting hole 8h, after injecting the adhesive into a slit part K from the outer circumferential face of the tip end part of the injection nozzle 21 in the state where the tip end part of the injection nozzle 21 comes close to the skin material layer 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006051730(A) 申请公布日期 2006.02.23
申请号 JP20040235929 申请日期 2004.08.13
申请人 NISHIKAWA KASEI CO LTD;MAZDA MOTOR CORP 发明人 NIIMI SHINGO;KANEKO MITSUHARU;TOCHIOKA TAKAHIRO
分类号 B29C65/42;B29L9/00;B29L31/58;B32B37/24 主分类号 B29C65/42
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