SYSTEM, METHOD AND APPARATUS FOR IMPROVED LOCAL DUAL-DAMASCENE PLANARIZATION

摘要

A system and method for planarizing a patterned semiconductor substrate includes receiving a patterned semiconductor substrate (100). The patterned semiconductor substrate includes a conductive interconnect material (120) filling multiple of features (102, 104,106) in the pattern. The conductive interconnect material having an overburden portion (112). The overburden portion (112) includes a localized non-uniformity (indicated in variations 114, 116, 118). An additional layer (202) is formed an the overburden portion. The additional layer and the overburden portion are planarized. The planarizing process substantially entirely removes the additional layer.