| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent mechanical damage due to separation between a lead frame and an outer lead. <P>SOLUTION: The outer lead which has a frame connecting an outer terminal and a connection part, and the lead frame which has a semiconductor chip mounting part and a connection receiving part, are disposed so that the connection part and the connection receiving part are coupled to each other. After mounting a semiconductor chip and performing wire connection and sealing with resin, the connection part of the outer lead is separated from the connection receiving part of the lead frame. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
