| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-depositing apparatus which prevents feed gases from reacting before they reach a processing board, minimizes the effect of radiant heat from the processing board, and makes the behavior of the gases in a reaction chamber more preferable for a deposited crystal film. SOLUTION: In the film depositing apparatus, a plurality of feed gases are made to react on the surface of a processing board 5 under heat to carry out film deposition. The processing chamber 1 is divided into a heating chamber 1a and a reaction chamber 1b. In the places counter to the processing board 5 exposed to the reaction chamber 1b, feed gas exhaust pipes 7 are disposed to be continuous with the reaction chamber 1b and supply ports 11, 12, from which respective feed gases are supplied separately to the surface of the processing board 5, are arranged to be outside of the exhaustion pipes 7. Such a constitution allows the feed gases to react in the close vicinity to the processing board 5 so that a proper crystal film is formed on the processing board 5. COPYRIGHT: (C)2006,JPO&NCIPI
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