发明名称 HIGH FREQUENCY WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce the reflection loss and transmission loss of a high frequency signal by reducing noise due to electric interference between differential signal lines and matching characteristic impedance in the differential signal lines. SOLUTION: A plurality of through-conductors 7 are formed at both the sides of each differential signal line 8, which includes a pair of signal lines formed in parallel on the upper surface of a dielectric board 2, so as to make a column in parallel with a line direction. The arrayal distance of the through-conductors 7 is made to be not more than one-fourth of the wavelength of a high frequency signal to be transmitted in the differential signal lines. On a lower surface ground conductor layer 6, a pair of island-shape non-formation parts 9 is formed in a part just under the respective signal lines 3, 4, of the differential signal lines 8, so as to be orthogonal to the line direction. The plurality of the pairs of the non-formation parts are formed in the line direction. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006042098(A) 申请公布日期 2006.02.09
申请号 JP20040221187 申请日期 2004.07.29
申请人 KYOCERA CORP 发明人 KABUMOTO MASANAO
分类号 H01P3/02;H01L23/12;H05K1/02 主分类号 H01P3/02
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