| 摘要 |
PURPOSE: A wire open/short tester of a semiconductor package is provided to minimize failure of products due to an abnormal wire and to reduce semiconductor package fabrication costs by detecting the abnormal wire during an open/short test using a short detecting part. CONSTITUTION: A wire open/short tester of a semiconductor package includes a clamp, a plurality of tester pins and a short detecting part. The clamp(61) is used for pressing a substrate(11). The plurality of tester pins(62) contact ball pads(11a) of the substrate. The short detecting part(63) is between the clamp and the tester pins. When an abnormal wire with a large height exists on the substrate, the clamp contacts the abnormal wire during an open/short test and the short detecting part detects immediately the short state. |
