| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board which can be improved in the adhesive strength of a conductor layer, and to provide a manufacturing method thereof. SOLUTION: An insulating layer 1 made of an insulator film etc., is prepared. Then a metal thin film 2 and a copper thin film 3 are formed in order on the insulating layer 1. Further, a dry film etc., are laminated on the copper thin film 3, and exposed and developed to form a plating resist in the reverse pattern of a conductor pattern to be formed in postprocessing. On the surface of the copper thin film 3 where the plating resist is not formed, the conductor pattern 5 is formed of copper by electrolytic plating using an electrolytic copper sulfate plating liquid. Then, the plating resist is removed by peeling etc. The copper thin film 3 is subjected to heat treatment. In this case, the copper thin film 3 is held at a temperature of 200 to 300°C for about one hour. Then the copper thin film 3 and the metal thin film 2 are removed by chemical etching except an area below the conductor pattern 5. COPYRIGHT: (C)2006,JPO&NCIPI
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