| 摘要 |
PROBLEM TO BE SOLVED: To prevent a band-like resistant heating body from being released or cracked even after heating and cooling are repeated, in a wafer heating apparatus comprising the resistant heating body. SOLUTION: One principal surface of a plate-like ceramic body 2 is used as a placing face 3 for placing a wafer thereon, a band-like resistant heating body 4 of one, two or more circuits are provided on another principal surface, and the surface of the resistant heating body or of an insulating layer covering the resistant heating body is formed. COPYRIGHT: (C)2006,JPO&NCIPI
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