| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of failure at picking up. SOLUTION: A first reference point 51 is set at the upper left of a wafer 41, and a second reference point 52 is set at the position of a chip 4 away in X-direction 13 in the same row. A third reference point 53 is set at the position of a chip 4 away in Y-direction 14 in the same row with the chip 4 of the first reference point 51, and a fourth reference point 54 is set at the position of a chip 4 which is in the same row with the chip 4 of the third reference point 53 while arranged in the same column with the chip 4 of the second reference point 52. After a wafer sheet 3 is expanded, a line segment P1 P2, line segment P1P3, line segment P3P4, and line segment P3P4 are equally divided by "the number of chips minus 1" present between the points to form virtual lines to form a grid containing vertical and horizontal line segments crossing each other. The position information of chips 4 read from wafer map data is corrected using a coordinate of intersections of the grid. COPYRIGHT: (C)2006,JPO&NCIPI
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