| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package of a small physical size by fastening primary and secondary semiconductor chips to each other. <P>SOLUTION: A transistor or a primary semiconductor chip 100, and a control IC or a secondary semiconductor chip 60 are fastened to each other. As a result, a small physical size package can be obtained, and the distance between electrical connection means can be shortened, thereby obtaining a small and high-performance semiconductor device. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
