| 发明名称 |
Thermal management arrangement with channels structurally adapted for varying heat flux areas |
| 摘要 |
An apparatus, method, and system for a thermal management arrangement for cooling semiconductor packages with channels structurally adapted for varying heat flux areas.
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| 申请公布号 |
US2005285261(A1) |
申请公布日期 |
2005.12.29 |
| 申请号 |
US20040877925 |
申请日期 |
2004.06.25 |
| 申请人 |
PRASHER RAVI S;CHIU CHIA-PIN;POKHARNA HIMANSHU |
发明人 |
PRASHER RAVI S.;CHIU CHIA-PIN;POKHARNA HIMANSHU |
| 分类号 |
F28D15/02;H01L23/34;H01L23/427;H01L23/473;(IPC1-7):H01L23/34 |
主分类号 |
F28D15/02 |
| 代理机构 |
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