| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a semiconductor device having a first semiconductor chip such as a CPU, a memory and so on, as well as a second semiconductor chip storing identification codes, being embedded in the device, and reading the identification codes without contacting; requires an extra space for housing an antenna for the second semiconductor chip to cause larger size of its package. <P>SOLUTION: A slit is provided in part of a lead frame used for mounting the first semiconductor chip, and the lead frame part regulated by the slit is used as an antenna. The second semiconductor chip is mounted on a position across the slit, and the lead frame in which the slit is formed is electromagnetically coupled with the second semiconductor chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
