| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip and a semiconductor device capable of satisfactorily connecting the semiconductor chip with an external substrate, or connecting mutual semiconductor chips, and moreover, capable of ensuring reliability in packaging of a semiconductor. <P>SOLUTION: The semiconductor device comprising: a semiconductor body; plural first terminals formed in the semiconductor chip; and second terminals each provided at a tip of the first terminal and each having a cross section smaller than a first cross section, is characterized in that a cross section of a tip portion of the second terminal is set to be larger than a cross section of a basic end portion of the second terminal. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
