| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate equipped with thin film electronic components which does not generate breaks of the thin film electronic components and can perform exact absorption. SOLUTION: In the circuit substrate equipped with the thin film electronic components, a substrate 1 has a coating film 13 consisting of soft insulating material arranged on a forming region of the thin film electronic component 3 and a protecting film 14 consisting of hard insulating material arranged in an external location of the forming region of the thin film electronic component 3, and since upper faces of the coating film 13 and the protecting film 14 are formed in about a same plane, an absorbing member 16 comes to contact with the upper faces of the coating film 13 and the protecting film 14 uniformly, therefore, a break of the thin film electronic component 3 can be eliminated because the absorbing member 16 does not contact with the thin film electronic component 3 directly. COPYRIGHT: (C)2006,JPO&NCIPI
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