发明名称 Method of forming trench in semiconductor device
摘要 There are provided a method of forming a trench for a recessed channel of a transistor and a layout for the same. A layout for the recessed channel according to one aspect of the present invention is formed such that an open region is extended across at least one of a first active region in a lateral direction, and also across another second active region in parallel with the first active region in a diagonal direction, and the extension is cut not to reach an isolation region between two third active regions that are in parallel with the second active region in a diagonal direction, and have noses facing each other in a longitudinal direction, and the layout includes an alignment of a plurality of open regions, which are discontinuously aligned. An etch mask is formed using the layout, and a semiconductor substrate is etched using the etch mask, and a trench for a recessed channel is formed on the active region.
申请公布号 US2005266646(A1) 申请公布日期 2005.12.01
申请号 US20050080891 申请日期 2005.03.16
申请人 GOO DOO-HOON;LEE SI-HYEUNG;CHO HAN-KU;WOO SANG-GYUN;YEO GI-SUNG 发明人 GOO DOO-HOON;LEE SI-HYEUNG;CHO HAN-KU;WOO SANG-GYUN;YEO GI-SUNG
分类号 H01L21/76;H01L21/00;H01L21/308;H01L21/8242;H01L27/02;(IPC1-7):H01L21/00 主分类号 H01L21/76
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