发明名称 |
Ceramic multilayer substrate and method for manufacturing the same |
摘要 |
The A ceramic multilayer substrate includes a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminals vertically formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of one of the pattern layers, is connected to one of the external terminal terminals so as to exchange signals with the outside, and be is broad enough to surround at least partially the connected external terminal. |
申请公布号 |
GB2395605(B) |
申请公布日期 |
2005.11.16 |
申请号 |
GB20030009414 |
申请日期 |
2003.04.24 |
申请人 |
* SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
DUK WOO * LEE;MYOUNG-LIB * MOON;SEOK TAEK * JUN |
分类号 |
H05K1/11;H01L23/498;H05K1/03;H05K3/00;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K1/11;H01L23/58;H01L21/48 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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