发明名称 |
Methods for manufacturing optical modules using lead frame connectors |
摘要 |
Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.
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申请公布号 |
US2005247759(A1) |
申请公布日期 |
2005.11.10 |
申请号 |
US20050066056 |
申请日期 |
2005.02.25 |
申请人 |
ICE DONALD A;DOUMA DARIN J |
发明人 |
ICE DONALD A.;DOUMA DARIN J. |
分类号 |
B23K31/00;B23K31/02;H05K1/14;H05K3/20;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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