| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device that can achieve excellent imaging quality without contaminating the imaging surface and improve a production yield, thus increasing productivity. SOLUTION: On the inner surface of a circuit substrate 14, a dent 16 that is larger in area than the imaging area 12 is formed, due to which a space h1 between the solid-state imaging device 11 and the circuit substrate 14 becomes large, thus resulting in elimination of a capillary phenomenon, which keeps sealing resin 19 from entering the imaging surface 12. COPYRIGHT: (C)2006,JPO&NCIPI
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