发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus where, even if there is variation in the thickness of a planar work, the desired position in the work can be efficiently machined. <P>SOLUTION: The laser beam machining apparatus is equipped with: a chuck table 36 provided with a work holding face of holding a planar work; a laser light application means 5 provided with a condenser 525 of applying laser light from the upper face side of the work held to the chuck table to produce condensing points; and condensing point position regulation means 53, 54 of moving the condensing points produced by the condenser to the direction vertical to the work holding face. The apparatus is further equipped with a height position detection means 6 of detecting the height position in the application region of the laser light applied from the condenser in the upper face of the work held to the chuck table; and a control means 10 of controlling the condensing point position regulation means based on a height position signal detected by the height position detection means. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005297012(A) 申请公布日期 2005.10.27
申请号 JP20040117496 申请日期 2004.04.13
申请人 DISCO ABRASIVE SYST LTD 发明人 NOMARU KEIJI
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/04;B23K26/08;B23K26/10;B23K26/40;H01L21/301;H01L21/304;(IPC1-7):B23K26/04 主分类号 B23K26/00
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