| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device exhibiting excellent reliability and manufacture stability. SOLUTION: The semiconductor device 100 comprises a semiconductor substrate 102 having a contact hole opening to one and the other surfaces, a solder ball 116 provided on one surface of the semiconductor substrate 102, an electrode 106 provided on the other surface of the semiconductor substrate 102, rewiring 110 for connecting the solder ball 116 with an electrode 106 provided at least partially in the contact hole of the semiconductor substrate 102, and a laminate type photosolder resist film 114 at least a part of which is provided in a part of the contact hole of the semiconductor substrate 102 and on one surface of the semiconductor substrate 102 wherein the laminate type photosolder resist film 114 contains cardo type polymer. COPYRIGHT: (C)2006,JPO&NCIPI |
