发明名称 METHOD AND DEVICE FOR POLISHING END DETECTION AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide the polishing end detection device of a chemical mechanical polishing device capable of accurately detecting a polishing end. <P>SOLUTION: Measuring light 12 is emanated from a light source 7 having an inclination corresponding to a Brewster angle (determined by refractive indices of a film to be polished exposed to the surface of a wafer 3 and of polishing slurry) with respect to the normal line of the surface of the wafer 3. Reflected light from the surface of the wafer 3 is passed through a polarizing plate 15 having a polarization axis disposed to remove an s polarization wave of the reflected light, and is incident on a light receiving unit 8 for photoelectric conversion. With the constitution, when a film having a different refractive index from the film to be polished is exposed, the Brewster condition is not satisfied so that a reflected wave from the wafer 3 does not include a p polarization wave. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294365(A) 申请公布日期 2005.10.20
申请号 JP20040104159 申请日期 2004.03.31
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TACHIBANA KENJI
分类号 B24B49/02;B24B37/013;B24B49/12;H01L21/304 主分类号 B24B49/02
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