| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for polishing wafers, which can polish the wafers with a small quantity of polishing fluid and suppress a cost by improving the application efficiency of the polishing fluid supplied to the surface of a polishing surface plate, and an apparatus therefor. <P>SOLUTION: Unused slurry and used slurry are separated by a reuse preventing means 6 provided so as to approach and separate from a polishing cloth 1 so that the used slurry cannot be reused by actively rejecting it and the unused slurry can be used. By this configuration, the polishing rate is improved and the polishing cost is reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
