发明名称 DEFECT INSPECTION METHOD AND ITS UNIT
摘要 PROBLEM TO BE SOLVED: To enable a real time inspection to check foreign matters of a wafer in the middle of transport concerning the inspection method for foreign matters of the wafer, and to prevent a large quantity of failures in the volume production line of a semiconductor production process before it happens, thereby maintaining the same yield level. SOLUTION: In the volume production line of a semiconductor production process, the physical size of a foreign matter inspection unit is reduced and the unit is located in the transport system between the input/output ports or processing units of the semiconductor production line. Also, a unit is provided to repeatedly detect foreign matters on the pattern parts on a wafer 111 by means of a lens array 153 of a refractive index variation type, spatial filter 154, and pattern information removal circuit, which makes it possible to inspect foreign matters on the wafer 111 in the middle of transport. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268823(A) 申请公布日期 2005.09.29
申请号 JP20050157274 申请日期 2005.05.30
申请人 RENESAS TECHNOLOGY CORP 发明人 MORIOKA HIROSHI;NOGUCHI MINORU;OSHIMA YOSHIMASA;KENBO YUKIO
分类号 H01L21/66;H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/66
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