METHOD AND APPARATUS FOR ELECTROPLATING PRODUCING PLATED LAYER IN UNIFORM THICKNESS,申请号KR20040019201-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR ELECTROPLATING PRODUCING PLATED LAYER IN UNIFORM THICKNESS
摘要
申请公布号	KR20050094083(A)	申请公布日期	2005.09.27
申请号	KR20040019201	申请日期	2004.03.22
申请人	HONG, JEONG PYO	发明人	HONG, JEONG PYO
分类号	C25D5/08;(IPC1-7):C25D5/08	主分类号	C25D5/08
代理机构		代理人
主权项
地址

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