发明名称 Method of attaching optical waveguide component to printed circuit board
摘要 Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
申请公布号 US2005205201(A1) 申请公布日期 2005.09.22
申请号 US20050126676 申请日期 2005.05.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM YOUNG-WOO;CHO YOUNG-SANG;YANG DEK-GIN;YIM KYU-HYOK
分类号 H05K3/32;G02B6/42;G02B6/43;H05K1/02;(IPC1-7):B32B31/00 主分类号 H05K3/32
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