| 摘要 |
PROBLEM TO BE SOLVED: To provide a test pad arrangement device and a program capable of arranging favorably a number of test pads as much as possible on a wiring pattern after lay-out design is finished, and capable of contributing to the facilitation of a trouble analysis and to the shortening of a trouble analysis time. SOLUTION: A processing pattern of a processing object is selected out of a plurality of the wiring patterns included in lay-out data D2 by a processing pattern selecting means 11. An unoccupied area capable of arranging the first test pad in a test pad arranging layer immediately the an upper side of the selected processing pattern is searched out of the processing patterns by an unoccupied area searching means 12 based on wiring rule information 31 and target layer information 34. The wiring layer located the under side by one layer of the uppermost layer wiring, for example, is assigned as test pad arrangement information therein. The first test pad is set in the test pad arranging layer in the searched unoccupied area by the first test pad setting means 13. COPYRIGHT: (C)2005,JPO&NCIPI
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