发明名称 METHOD FOR EXTRACTING BUMP IMAGE ON MOUNTING SUBSTRATE FOR SEMICONDUCTOR DEVICE, INSPECTION METHOD OF BUMP IMAGE, PROGRAM FOR METHODS, RECORDING MEDIUM FOR RECORDING PROGRAM, AND INSPECTION DEVICE OF BUMP
摘要 <P>PROBLEM TO BE SOLVED: To recognize accurately a bump area as a preceding step of image processing by a subtraction method. <P>SOLUTION: A both-surface mounting substrate which is an inspection object is measured, and its radiographic image is taken, and a bump simple body image is extracted. Relative position information of the bump simple body image is acquired, and a bump position overlapped with another image is estimated from regularity of bump arrangement. The estimated bump position is corrected by utilizing, for example, Hough transform. The bump area is determined by, for example, matching with a circular pattern having the equal size as the bump on the corrected bump estimated position. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005257424(A) 申请公布日期 2005.09.22
申请号 JP20040068639 申请日期 2004.03.11
申请人 SHIMADZU CORP 发明人 YAHAGI EIJI
分类号 G01N23/04;G06T1/00;G06T7/60;H01L21/60;H05K3/34 主分类号 G01N23/04
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