| 摘要 |
An optical sub-assembly module comprises a receptacle combined with a light emitting device. The receptacle has an optical axis and a one-piece condensing device with a dual lens structure and aligning with the optical axis. The light emitting device is either a traditional LED, a laser diode, a light emitting component with a TO-CAN structure, or a photo detector (PD). The light may radiate through an opening in the pervious direction of the outer seal of each light emitting device. The pervious side of the light emitting chip in each light emitting device may be designed without micro lenses. The optical sub-assembly module is capable of improving the light coupling effect with the one-piece dual lens structure in the receptacle. The combination process of the receptacle and the light emitting device is compatible with the existing process. Each light emitting device has an opening at its outer seal end and a light emitting chip without micro lens structure to lower production costs. The opening structure brings the lens of the receptacle closer to the light emitting chip to improve the light condensing effect.
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