| 摘要 |
In an electroless plating method and apparatus, an electroless plating solution is supplied onto a substrate, a reaction acceleration condition is applied to the electroless plating solution to accelerate a reaction, and a coating is formed on the substrate by using the electroless plating solution to which the reaction acceleration condition has been applied. Further, In an electroless plating method and apparatus, a first coating is formed on a substrate by using a first electroless plating solution at a first coating formation rate, and a second coating is formed on the substrate, on which the first coating has been formed, by using a second electroless plating solution at a second coating formation rate higher than the first coating formation rate. The methods allow a coating to be formed in a recess portion, uniformly.
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