<p>The present invention provides an apparatus (10) for plasma treatment of a substrate surface (16). The apparatus comprises a plasma source (12) for generating a plasma and a plasma-control electrode (14). The apparatus further comprises a drive means for effecting a relative movement between the plasma-control electrode (14) and the plasma source (12) or of the plasma-control electrode (14) and the plasma source (12) relative to the substrate (16). The plasma-control electrode (14) is located adjacent the substrate (16) to facilitate treatment of the substrate surface (16) in a controlled manner.</p>
申请公布号
WO2005081592(A1)
申请公布日期
2005.09.01
申请号
WO2005AU00227
申请日期
2005.02.21
申请人
THE UNIVERSITY OF SYDNEY;YIN, YONGBAI;BILEK, MARCELA;MCKENZIE, DAVID;IMENES, ANNE, GERD