发明名称 METHOD FOR DIVIDING SUBSTRATE AND METHOD FOR MANUFACTURING SUBSTRATE USING SUCH METHOD
摘要 A main scribe line (MS) is formed along an intended divide line of a mother glass substrate (10) by sequentially forming vertical cracks (Vm) along the intended divide line. The vertical cracks (Vm) extend in the thickness direction of the mother glass (10). Next, a subsidiary scribe line (SS) is formed along the main scribe line (MS), with a certain space therefrom. Consequently, the mother glass substrate (10) is divided along the main scribe line (MS). With this method, a substrate can be efficiently divided without requiring any complicated apparatus or the like.
申请公布号 KR20050083967(A) 申请公布日期 2005.08.26
申请号 KR20057009268 申请日期 2005.05.23
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 NISHIO YOSHITAKA
分类号 C03B33/023;C03B33/10;G02F1/1333 主分类号 C03B33/023
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