发明名称 PARALLEL CONDUCTOR PLATE TRANSMISSION PATH
摘要 PROBLEM TO BE SOLVED: To provide a parallel conductor plate transmission path, capable of providing more signal lines on the main surface of a dielectric substrate, without causing increase in its size. SOLUTION: Signal lines 2a and 2b are provided on one main surface of a dielectric substrate 101. Plural other signal lines 2c and 2d are provided on the other main surface of the dielectric substrate 101. The signal lines 2a and 2b on the one main surface and the signal lines 2c and 2d on the other main surface are so provided as to extend parallel to each other. A ground pattern 3b, whose electric potential is fixed, is provided between the adjacent signal lines 2a and 2b on one main surface, while a ground pattern 3e whose electric potential is fixed is provided between the adjoining signal lines 2c and 2d on one main surface. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005223127(A) 申请公布日期 2005.08.18
申请号 JP20040029180 申请日期 2004.02.05
申请人 SHARP CORP 发明人 TSUCHIHATA KOSUKE
分类号 H01P3/08;H05K1/02;H05K3/46;(IPC1-7):H05K1/02 主分类号 H01P3/08
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