| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily identify solder resist and an outer lead on a printed board in visual inspection, after the printed board has been mounted, while obtaining adhesion to a mold resin by plating the surface of a lead frame. <P>SOLUTION: A resin-sealed semiconductor device, in which a semiconductor chip 20 and a lead frame 30 are sealed with a mold resin 50, comprises a plating film 30a formed on the surface of the lead frame 30 to improve the adhesion with the mold resin 50 and a glossy surface 32b formed on an inspection surface 100a, to be subjected to a visual inspection on the outer lead 32 of the lead frame 30, after mounting to the printed board. The glossy surface 32b is highly glossy because of high flatness on the plating film 30a as compared with the other parts of the lead frame 30. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
