| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component sealing substrate excellent in productivity in manufacturing an electronic device by gas-tightly sealing a micro electronic and a mechanical system arranged on a principal plane of a semiconductor substrate and excellent in electromagnetic noise characteristics, and an electronic device manufacturing method. <P>SOLUTION: The electronic component sealing substrate 6 is composed of an insulation substrate 1 having a plurality of wiring conductors 2 formed therein by being introduced from one principal plane to the other principal plane or a side surface, a connecting pad 3 which is formed on one principal plane of the insulation substrate 1 and connected with the wiring conductor 2, a frame member 4 which is joined to one principal plane of the insulation substrate 1 so as to surround the connecting pad 3, a connecting terminal 5 which is formed on the connecting pad 3 and has the same height as that of the frame member 4, and a low-pass filter 12 formed inside or on the insulation substrate 1 using a conductor pattern, and an electronic component 10 having a micro electronic and mechanical system 8 and electrodes 9 connected thereto formed on the principal plane of a semiconductor substrate 7 connects the electrode 9 to a connection terminal 5, and the micro electronic and mechanical system 8 inside the frame member 4 is air-tightly sealed by connecting the principal plane of the semiconductor substrate 7 to the principal plane of the frame member 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
