ADHESIVE FILM AND METHOD FOR PROTECTING SEMICONDUCTOR WAFER USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film which has excellent adhesiveness to the surface of a semiconductor wafer and easy peelability when not needed and is used for polishing the back side of the semiconductor wafer. SOLUTION: This adhesive film is characterized by forming on at least one side of a substrate film an adhesive layer comprising a blocked polyisocyanate having at least two blocked isocyanate groups capable of being thermally dissociated to reproduce isocyanate groups in the molecule and a polymer having groups capable of reacting with the isocyanate groups. COPYRIGHT: (C)2005,JPO&NCIPI