Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

摘要

A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111 ); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111 ; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111 , said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114 b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114 a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112 a of the conductive layer 112.