发明名称 |
POLIERKISSEN MIT INTEGRIERTEM OPTISCHEN SENSOR |
摘要 |
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission. |
申请公布号 |
DE60020746(D1) |
申请公布日期 |
2005.07.14 |
申请号 |
DE2000620746 |
申请日期 |
2000.07.03 |
申请人 |
STRASBAUGH, SAN LUIS OBISPO |
发明人 |
WOLF, H. |
分类号 |
B24B49/00;B24B49/12;B24D13/14;H01L21/304;(IPC1-7):B24B37/04;B24D7/12;B24B49/04 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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