Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product

摘要

According to the present invention, a case housing a product and a lid made of material that transmits a laser beam are fixed to each other with a bonding member interposed between them, and thereafter, a laser beam is focused onto the bonding member through the lid so that the bonding member is melted. By doing so, the case and the lid are welded together via the bonding member.