发明名称 HIGHLY HEAT-CONDUCTIVE ALUMINUM NITRIDE SINTERED COMPACT
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly heat-conductive aluminum nitride sintered compact high in heat conductivity and excellent in heat dissipation and mechanical properties. <P>SOLUTION: The highly heat-resistant aluminum nitride sintered compact has the following characteristics: the ratio (IAl<SB>2</SB>Gd<SB>4</SB>O<SB>9</SB>/IAlN) of the X-ray diffraction intensity IAl<SB>2</SB>Gd<SB>4</SB>O<SB>9</SB>of Al<SB>2</SB>Gd<SB>4</SB>O<SB>9</SB>(310 plane) to the X-ray diffraction intensity IAlN of aluminum nitride (101 plane) is 0.04 or lower; the ratio (IAlGdO<SB>3</SB>/IAlN) of the X-ray diffraction intensity IAlGdO<SB>3</SB>of AlGdO<SB>3</SB>(112 plane) to the X-ray diffraction intensity IAlN is 0.05 or lower; the ratio (IGd<SB>2</SB>O<SB>3</SB>/IAlN) of the X-ray diffraction intensity IGd<SB>2</SB>O<SB>3</SB>of Gd<SB>2</SB>O<SB>3</SB>(401 plane) to the X-ray diffraction intensity IAlN is 0.002-0.06; the heat conductivity is 215 W/m&times;K or higher; and the three-point bending strength is 250 MPa or higher. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005187235(A) 申请公布日期 2005.07.14
申请号 JP20030428004 申请日期 2003.12.24
申请人 TOSHIBA CORP;TOSHIBA MATERIALS CO LTD 发明人 KOMATSU MICHIYASU;MIYASHITA KIMIYA
分类号 C04B35/581;H01L23/373 主分类号 C04B35/581
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