发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which neither malfunction nor errors occur even if a frequency exceeds 3GHz. SOLUTION: A distance D1 between a conductor layer 34P on a surface of a multilayer core substrate 30 and an inner conductor layer 16E , a distance D2 between the inner conductor layer 16E and a metal plate 12, a distance D3 between the metal plate 12 and the inner conductor layer 16P, and a distance D4 between the inner conductor layer 16P and a conductor layer 34E at a rear face are made uniform. Mutual inductance between the conductor layers and the metal plate is set constant, and inductance as the whole core substrate 30 is lowered by arranging the conductor layers and the metal plate so that the distances become uniform. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005183466(A) 申请公布日期 2005.07.07
申请号 JP20030418162 申请日期 2003.12.16
申请人 IBIDEN CO LTD 发明人 KATO SHINOBU
分类号 H05K1/05;H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/05
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