| 摘要 |
A method for fabricating apparatus for testing semiconductor devices includes forming protective structures for bond wires or other intermediate conductive elements thereof by sequentially fabricating one or more material layers. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure. In addition, a fence member may be assembled with or formed on the test substrate to align and receive a semiconductor device and, thereby, to facilitate assembly of the semiconductor device with the test substrate. The fence member can be formed integrally with the protective structures or secured over the protective structures. Stereolithographic processes may be used to fabricate the fence member. |
