发明名称 MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent the clogging of a gas injection path by a resin material and to facilitate maintenance. SOLUTION: In a molding apparatus, gas and the resin material are injected simultaneously into a cavity in a mold to mold the resin material. A valve mechanism 10 is set in the gas injection path 8 which is made to communicate with a gas runner 7 in the mold (a fixed mold 6 and a movable mold 16) connected to the cavity 1. The valve mechanism 10 has a sleeve member 11 arranged along the gas injection path 8 and a rod member 12 inserted into the sleeve member 11. By moving the rod member 12 in relation to the sleeve member 11, the gas injection path 8 is made to communicate with the gas runner 7, or the communication can be intercepted. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005169845(A) 申请公布日期 2005.06.30
申请号 JP20030413297 申请日期 2003.12.11
申请人 DAIWA KASEI IND CO LTD 发明人 KONDO TOSHIAKI;HIROHAMA MOTOYUKI;IWASE YASUHIRO
分类号 B29C45/00;B29C45/17;B29L22/00;(IPC1-7):B29C45/00 主分类号 B29C45/00
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