| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of sealing through-holes by which a high-quality and high-yield sealing state of the through-holes can be obtained without any occurrence of warping defects due to polishing pressure even with a thin printed wiring board. SOLUTION: The plating through-holes of the printed wiring board are filled and sealed with a thermal expansion type hole filling material. COPYRIGHT: (C)2005,JPO&NCIPI
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