发明名称 DICING DIE BOND SHEET
摘要 PROBLEM TO BE SOLVED: To provide a dicing die bond sheet from which a protecting film can easily be peeled without weakening the sticking force of a sticky agent and which can sufficiently stick a dicing ring and facilitates the subsequent dicing process, and the like. SOLUTION: This dicing die bond sheet prepared by laminating an adhesive (die bonding material) 2 having a prescribed planar view shape, a sticking agent which covers the adhesive 2, has a larger size than that of the adhesive 2, and has a peripheral portion (used as a dicing ring-loading portion) not overlapping with the adhesive, and a substrate film overlapping with the sticking agent in this order to one side of a protecting film 1 is characterized in that a projected portion projected in a state contacting with or approaching the outer periphery of the sticking agent at at least one position on the planar view is formed in the outer periphery of the adhesive 2. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162818(A) 申请公布日期 2005.06.23
申请号 JP20030401592 申请日期 2003.12.01
申请人 HITACHI CHEM CO LTD 发明人 FURUYA SUZUSHI;URUNO MICHIO;MATSUZAKI TAKAYUKI;KANEDA MAIKO;MASUNO MICHIO;INADA TEIICHI;OKUBO KEISUKE
分类号 C09J7/02;C09J201/00;H01L21/301;(IPC1-7):C09J7/02 主分类号 C09J7/02
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