| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which is used for sealing semiconductors, whose melt viscosity is lowered to improve the chargeability of the resin composition as a sealing material, and which can prevent the occurrence of a trouble such as an unfilled state. SOLUTION: The resin composition for sealing semiconductors comprises the following components (A) a thermosetting resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an organic silicon compound having an organic group comprising a structure whose polar site is nipped with non-polar sites. COPYRIGHT: (C)2005,JPO&NCIPI
|
