发明名称 Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips
摘要 A method for fabricating an electrical test apparatus electrical probe tip first provides a probe tip substrate having a topographic surface. A high density plasma chemical vapor deposition (HDP-CVD) deposited mandrel layer is then formed upon the topographic surface. It has a series of pointed tips formed over a series of topographic features within the topographic surface. Finally, a conductor probe tip layer is formed conformally upon the high density plasma chemical vapor deposition (HDP-CVD) deposited mandrel layer and replicating the series of pointed tips. Due to the series of pointed tips and the series of replicated pointed tips, a microelectronic fabrication when tested with the electrical test apparatus electrical probe tip is tested with enhanced accuracy.
申请公布号 US6909300(B2) 申请公布日期 2005.06.21
申请号 US20020143412 申请日期 2002.05.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD 发明人 LU NAI-CHENG;LIAO YU-TING;LIU FU-SUNG
分类号 G01R1/067;G01R3/00;(IPC1-7):G01R31/26 主分类号 G01R1/067
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